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MROD-X Component Side Thermal Picture

The GOL input links were interconnected by loopback fibers from MRODIN to MRODIN, so that sender and receiver were in different clock domains. Test software that generates CSM-like input data on the GOL outputs was running on the MRODIN DSPs and software that spyed on the event data and performed a full check on the data in real-time, was running on the MRODOUT DSP. The full hardware chain from MROD-X GOL; input up to, but not including, the SLINK output was thus continuously active (in this case: 6 GOL inputs and onboard RocketIO links) generating and processing event data.

FPGA silicon temperatures were read out by the test software:

FPGA:
 Degrees Centigrade
Channel 1-A
 42
Channel 1-B
 45
Channel 2-A
 43
Channel 2-B
 45
Channel 3-A
 40
Channel 3-B
 41
MROD-Out
 56

MROD-X Component Side Thermal Picture

Note that the thermal camera records radiated heat.
The FPGAs packages are made out of metal which reflects heat rather than radiate heat. This is why the FPGAs look "cool" as if you are looking into a mirror that reflects the radiated heat in the laboratory. The black text on the FPGA packages ("Xilinx Virtex-II Pro") radiates heat and thus this text looks "hot". The heat of the FPGAs is transported into the Printed Circuit Board via the solder balls of the Ball Grid Array.
The black plastic SHARC DSP packages radiate the heat directly.

Normal picture of the MROD-X Component Side
Last Updated: 03-01-2007
Peter Jansweijer