Mechanical Technology's facilities
Below is a list of the key equipment used in the mechanical technology department. Apart from this list, the department is equipped with a large number of specialty machines.
Material processing
♦ CNC milling up to 2000 x 700 x 1000 mm
♦ CNC turning
♦ Conventional up to 575 x 1500 mm
♦ Bending, setting, shearing up to 2400 mm length and 3 mm thickness
♦ Various welding devices (orbital, point, plasma, mig and tig) up to 480 ampere
♦ Punching, throat 500 mm
♦ Various ovens up to 1500 x 1500 x 1500 mm and 1250° Celsius
♦ Tapping machines from M1
- CNC turning
- CNC milling
3D measurements
♦ 3D measurements up to 1200 x 2000 x 1000 mm
Processing of wafers and other microelectronics
♦ Wire bonding; Delvotec 6320, Hesse and Knipps BJ820, TPT HB16 and Mech-El 907
♦ Phenom Electron microscope
♦ Buehler IsoMet 4000 Dicing Saw
♦ Buehler Beta cutting and polishing machine
♦ March PX-250 Plasma Cleaner
♦ Dage 4000 Pull/Shear tester
♦ Pull Tester Royce 220
♦ Suss 300 mm Wafer prober and Micro manipulator 200 mm wafer prober
♦ Various optical microscopes
♦ Pick an Placer Cammax Precima DB 600
- The bonding lab
Nikhef has a total of 13 cleanrooms up to class 1.000. The clean rooms are equipped with ESD-safe flooring and have a surface area of up to 170 m2. Several of these cleanrooms are also equipped with highly accurate climate control (temperature and humidity).
More information? Please contact the department.
